|SK Hynix beats estimate|
Prices of benchmark DDR3 4-Gb dynamic random access chips rose to $2.01 as of Sept. 30 compared with $1.73 a quarter earlier, according to InSpectrum Tech Inc. The flash NAND market will sustain a positive trend, company said.
|Smartwatch market might not survive|
the third quarter of 2015 was the first time the Apple Watch had widespread retail availability after a limited online launch, while the second generation of the device was only available in the last two weeks of the third quarter of 2016. This led to a 71.6 percent year-over-year fall in Apple Watch shipments in the latest quarter.
|China Le Eco wants to be the next Google|
At an event on Wednesday in San Francisco, LeEco is showing off a selection of products, including UHD TVs, smartphones, virtual reality goggles and electric bikes, which will soon go on sale to US consumers.
|Artificial Intellegence to analyse and adjust traffic flows|
Fujitsu Laboratories and Fujitsu Research and Development Centre have developed what they described as a highly accurate vehicle-recognition technology that tolerates changes in the surrounding environment, including changes in light, time of day and fog, and another technology for efficiently identifying complex incidents, such as traffic accidents.
|Singapore to test self-driving bus|
LTA will partner the Energy Research Institute @ NTU (ERI@N) to develop autonomous bus technologies, which include conducting a self-driving bus trial for fixed and scheduled services for intra- and inter-town travel.
|Samsung mobile DRAM advanced to 10nm |
The new package of mobile chips is expected to significantly improve mobile user experiences for those using high-definition, large-screen devices.
|SMIC to use eMemory Non-volatile memory technology|
The tie-up between eMemory and SMIC has already provided cost-effective solutions for applications including microcontrollers (MCU), power management ICs (PMIC), multimedia players, digital TVs and digital set-top boxes (STB).
|Winbond enters into 3X nm DRAM production|
Winbond will complete the installation of manufacturing equipment for its new Fab C at the end of 2016, allowing the fab to enter wafer production in the first quarter of 2017.
|Intel earning up on cloud chip sales|
>Were executing well, and these results show Intels continuing transformation to a company that powers the cloud and billions of smart, connected devices,