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Monday, October 16, 2017
Industry News
Samsung foundry now offers 11nm process 9/12/2017
The 11-nanometre Low Power Plus, or 11LPP, was achieved from further scaling from the earlier generation 14-nanometre process. It offers 15 percent more performance and is 10 percent smaller, while power consumption is the same.
Production glitches may lead to iPhone supply shortfalls 9/11/2017
The iPhone, which will be unveiled on September 12 at an Apple event, experienced issues that pushed back the manufacturing process by about a month, said the report, citing people familiar with the matter.
Movandi offers RFIC design for 5G networks 9/11/2017
Its RFIC, phased array antenna and beamforming techniques will enable the next generation of 5G and multi-gigabit connectivity.
Micron to spend $2 billion a year for multiple years on Taiwan fab. 9/11/2017
Through the investment, the US memorychip maker plans to upgrade its DRAM chip manufacturing to next-generation processes and build its first 3D DRAM chip packaging operation in Taiwan over next three to five years.
Apple and Softbank back new Foxconn bid on Toshiba 9/11/2017
“We are offering something that I don’t think anyone can refuse,"
Huawei now sells more smartphones worldwide than Apple 9/8/2017
Huawei is still not a hugely popular brand in the US, but sales in China, Europe, Latin America, and the Middle East helped propel it into second spot behind Samsung in July.
EU has doubts on proposed Qualcomm/NXP merger 9/8/2017
The European Commission paused its investigation on Aug. 17, a filing on its website showed. It had previously set a Dec. 6 deadline for its decision.
DRAM module demand dropped 12% in 2016 9/8/2017
PC DRAM ASPs for all of 2016 still plunged by 34% compared to 2015. Average spot prices for PC DRAM suffered an even steeper drop. Consequently, the overall DRAM module industry took a major hit in revenues with most suppliers experiencing revenue declines in 2016.
Huawei to invest $250 million in integrated partner program 9/8/2017
The investment in the new Huawei Solution Partner Program includes $70 million to be spent on "co-marketing" with its partners, with Huawei to fund the technical, marketing, and sales resources needed for its partners to develop, construct, and market Huawei-based solutions.
Microchip offers supper flash aimed at battery powered applications 9/7/2017
SuperFlash technology reduces power consumption by providing much faster erase times of between 35 and 50 milliseconds, compared to competitive Flash devices which take more than 30 seconds to erase.
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